International Symposium on Sputtering and Plasma Processes (ISSP) was established in 1991. The main subject of the 1st symposium was “Reactive Sputtering”. It was the time that some new approaches to improve deposition rate and stability of the reactive sputtering process were started to be addressed. Since then, the symposium has been held biennially. At each symposium, the current topics and trends concerning sputtering and plasma processes have become the main focus and such topics have been discussed intensively.